Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 / 11 Pro
Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone 11 / 11 Pro
Spread the cost
No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R162.61/mo 3 months
- R82.23/mo 6 months
- R43.4/mo 12 months
- From R162.61/month over 3 months, or as low as R43.4/month over 12. Total repayable over 12 months: R520.8. Interest at 20.75% p.a. applies.
- Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
- Mobicred is a registered South African credit provider (NCR reg. NCRCP7852). Available to SA residents aged 18+ with a valid ID and bank account.
At checkout, simply select Mobicred as your payment method.
Continue to checkoutDon't have Mobicred yet? Apply free — takes about 2 minutes →
Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
Import Taxes & Duties Included
6-13 business days
In Stock CHN
Processing time: 1-3 days
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Description
Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform is a repair platform designed for soldering. It provides strong magnetic adsorption for accurate positioning and efficient soldering of components on iPhone 11 and 11 Pro motherboards.
- Product Type: Repair Platform
- Compatibility: iPhone 11 / 11 Pro
- Material: Pewter
- Key Feature: Strong magnetic adsorption
- Intended Use: Soldering
- Temperature Resistance: High temperature resistance
- Heat Dissipation: Easy heat dissipation
- Operation: Simple operation
- Positioning: Accurate positioning without damage to the motherboard
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