AMAOE 0.12mm Reballing Stencil For iPhone 14 Series
AMAOE 0.12mm Reballing Stencil For iPhone 14 Series
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5-10 business days
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Description
BGA stencil designed for reballing IC chips in iPhone 14 Series devices. It provides precise alignment and improves reballing efficiency for high-precision repairs.
- Product Type: BGA Stencils
- Compatibility: iPhone 14 Series
- Material: Stainless Steel
- Design: Ultra-thin, 0.12mm
- Color: Silver
- Intended Use: High-precision IC chip repairs
- Heat Resistance: Excellent
- Corrosion Resistance: Excellent
- Durability: Highly durable and wear-resistant
- Cleaning: Easy to clean
- Reuse Cycles: Capable of withstanding hundreds of cycles
- Cutting Technology: Laser micron-level cutting
- Aperture Sizes: Uniform
- Solder Ball Alignment: Highly accurate
- Operation: Quick and easy
- Efficiency: Improves reballing efficiency and reduces rework rates
- Application: Suitable for individual technicians and professional mass production environments
- Cost-Effectiveness: Lowers repair costs
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