AMAOE 0.12mm Reballing Stencil For Face ID IC
AMAOE 0.12mm Reballing Stencil For Face ID IC
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Description
AMAOE 0.12mm Reballing Stencil is a BGA stencil designed for high-precision IC chip repairs. It is suitable for Apple chip models, improving reballing success rates and ensuring optimal performance.
- Product Type: BGA Stencils
- Compatibility: Apple chip models including CPUs, basebands, power management ICs, and other common chips
- Material: Stainless steel
- Color/Variant: Silver
- Key Feature: Ultra-thin design (0.12mm)
- Heat Resistance: Excellent
- Corrosion Resistance: Excellent
- Durability: Highly durable and wear-resistant
- Reuse Cycles: Capable of withstanding hundreds of reuse cycles under normal conditions
- Cleaning: Easy to clean
- Cutting Technology: Laser micron-level cutting technology
- Aperture Sizes: Uniform sizes for accurate solder ball alignment
- Operation: Precisely aligned hole positions for quick and easy operation
- Efficiency: Improves reballing efficiency and reduces rework rates
- Intended Use: High-precision IC chip repairs
- Cost-Effectiveness: Significantly lowers repair costs
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