100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets, Thickness: 0.3mm
100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets, Thickness: 0.3mm
Spread the cost
No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R96.74/mo 3 months
- R48.92/mo 6 months
- R25.82/mo 12 months
- From R96.74/month over 3 months, or as low as R25.82/month over 12. Total repayable over 12 months: R309.84. Interest at 20.75% p.a. applies.
- Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
- Mobicred is a registered South African credit provider (NCR reg. NCRCP7852). Available to SA residents aged 18+ with a valid ID and bank account.
At checkout, simply select Mobicred as your payment method.
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Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
Import Taxes & Duties Included
6-13 business days
In Stock CHN
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Description
100 pieces of red copper thermal cooling pads designed for Android smartphone CPUs provide effective heat dissipation. These pads are suitable for use after chip reballing or motherboard maintenance to prevent overheating.
- Quantity: 100 pieces
- Material: Oxygen-free pure copper
- Dimensions: 12.4mm x 14mm
- Thickness: 0.3mm
- Compatibility: Designed for Android smartphone CPUs
- Function: Provides targeted heat dissipation
- Application: Replaces damaged OEM thermal materials after CPU rework
- Prevents short circuits with precision-customized dimensions
- Available thickness options: 0.1mm, 0.3mm, 0.5mm
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